Process
PCB
Layer Count1 - 30
CategoriesHigh layer count through-hole board, gold finger card board, selective ENEPIG board, industrial control board, thick copper board, optical communication module and 5G related PCB
Board Thickness0.4-3.2mm
Mechanical DrillSmallest Drill: 0.15mm, Smallest Slot: 0.45mm
Min. Board Size2.5*3mm
Max. Board SizeShort Side< 620mm，Long Side< 720mm
Min. Line Width / Spacing3mil/3mil
Through Hole Aspect Ratio12:1
Max. Finished Copper ThicknessInner: 6oz, Outer: 6oz
Impedance ToleranceRegular: ±10%, Limit:±8%
Solder Mask ColorGreen, Yellow, Black, Blue, Red, White
Legend ColorWhite, Yellow, Blue
MaterialRegular Board: SYTECH, KB, Nanya, GDM
Special Board: Rogers Surface FinishOSP, HASL, LF-HASL, Electroplated Gold (Finished Cooper Thickness ≤ 43um), ENIG, Hard Gold Plating, Flash Gold, ENIG + OSP, ENEPIG
Special Board: Rogers Surface FinishOSP, HASL, LF-HASL, Electroplated Gold (Finished Cooper Thickness ≤ 43um), ENIG, Hard Gold Plating, Flash Gold, ENIG + OSP, ENEPIG
PCBA
Single Line Capacity150,000 placements/hr
(0402/0603 24hrs*30days) Board ThicknessPCB: Max. 0.3mm, Min. 6mm, FPC, Rigid-Flex PCB Min. Board Size50mm*50mm Max. Board Size460mm*700mm ProcessLead-Free, SMT Adhesive, DIP, Automated Conformal Coating Precision0201 BGA 0.3mm pitch Special ProcessCPK
(0402/0603 24hrs*30days) Board ThicknessPCB: Max. 0.3mm, Min. 6mm, FPC, Rigid-Flex PCB Min. Board Size50mm*50mm Max. Board Size460mm*700mm ProcessLead-Free, SMT Adhesive, DIP, Automated Conformal Coating Precision0201 BGA 0.3mm pitch Special ProcessCPK